Form：360doc 2017/12/25Browse：4160
DRAM market conditions will be different next year, DRAM market will continue to be tight, NAND Flash market will be in the first half of next year into oversupply.
Form：360doc 2017/12/19Browse：3694
iPhone X to give up fingerprinting Face ID gradually gaining market acceptance, so that non-Apple camp phone factory also accelerated layout, according to vendor vendors revealed that Huawei, OPPO, millet and other brand manufacturers have embraced 3D sensor technology. It is foreseeable that with the 3D sensing technology market continues to open, 2018 will launch a new machine with 3D sensor capabilities will spring up, the fingerprint recognition application under the screen may face crowding-out effect.
Form：MediaTek.Inc 2017/12/19Browse：4710
MediaTek has been aggressively pursuing the 5G market. Together with ITRI, it has developed LWA (LTE / Wi-Fi Link Aggregation) technology to improve network transmission bandwidth and 38/39 GHz millimeter-wave high-band access technology , And MUST (Multi-User Superposition Transmission) technology that supports the transmission capacity of small base stations. It has made headway and business opportunities for Taiwan to enter the global 5G communications market and is moving towards the goal of 5G network commercialization by 2020.
Form：Murata 2017/12/19Browse：4413
Murata Manufacturing Co., Ltd. (hereinafter referred to as "Murata") has worked for many years in the field of communication modules. A few years ago the rapid development of the Internet era, Murata 2.4G Hz communication module has been playing a decisive role in all walks of life, from the phone's Wi-Fi module to the Bluetooth module used in the car, and then to the smart home Involved ZigBee module, Murata rely on a wide range of products and excellent reputation of quality again and again won the trust of customers. By 2017, at a critical period of explosive growth of this Internet of Things technology, Murata is also closely following the tide of the market and has taken the lead in the field of LPWAN (Low Power Wide Area Networks).
Form：NVIDIA 2017/9/22Browse：6126
NVIDIA today announced the release of the 17.7 Edition PGI 2017 Compiler and Tools to help high-performance computing systems developers develop higher-performing software for systems equipped with multi-core CPUs and heterogeneous GPU accelerators, while dramatically simplifying program design Process.
Form：Tektronix 2017/9/22Browse：5358
Tektronix, the world's leading supplier of measurement solutions, today introduced the new DPO7OE1, a calibrated optical probe and analysis software for use with real-time oscilloscopes, and is an optical reference for compatibility with 28-GBaud PAM4 applications Receiver (ORR), and can support IEEE / OIF-CEI standard specific measurement. The new solution complements Tektronix's sampling oscilloscope optical PAM4 analysis tool, providing the design team with an effective test solution for all stages of the optical transmitter workflow.
Form：NXP Semiconductors 2017/9/19Browse：5730
NXP Semiconductors N.V., the world's largest supplier of automotive semiconductor solutions, today announced a new generation of RoadLINK solutions that extend its leadership in the field of vehicle-to-everything communications. The new NXP SAF5400 is the world's first high-performance single-chip DSRC modem with automotive standards. With a unique scalable architecture, industry-leading new security features, and advanced RF complementary metal oxide semiconductor components (RFCMOS) and Software Defined Radio (SDR) technology, OEM manufacturers offer flexible options to District deployment of security V2X and on-site upgrades.
Form：Western Digital (WD) 2017/9/19Browse：4746
SAN FRANCISCO (MarketWatch) - Western Digital Inc. (NYSE: TXN) today announced the launch of the 400GB Flash Digital High-Speed Mobile MicroSDXC UHS-I card, a microSD card for high-capacity mobile devices. After two years ago, after launching the 200GB Red Dodge high-speed mobile microSDXC card, Western Digital Inc. doubled storage capacity to double the same volume of SD card to 400GB.
Form：KLA-Tencor 2017/9/18Browse：4567
KLA-Tencor today introduced five development control systems for logic and cutting-edge memory design nodes below 7 nm to help wafer manufacturers achieve the rigorous process tolerances required for multiple exposure techniques and EUV lithography. At the IC manufacturing facility, the ATL stacking measurement system and the SpectraFilmF1 thin film measurement system provide process characterization analysis and offset monitoring for the fabrication of finFET, DRAM, 3D NAND and other complex component structures.
Form：Semtech 2017/9/8Browse：4885
Semtech Corporation (Nasdaq: SMTC), a leading provider of high-performance analog and mixed-signal semiconductors products and advanced algorithms, today announced that Chipsafer, a startup that specializes in providing Internet of Things (IoT) services for livestock management, uses Semtech's LoRa® devices and wireless RF technology (LoRa technology) to develop its ranch solution platform. Chipsafer's sensors forward sensor data from livestock, including body movements, local humidity, temperature and location, using LoRaWAN-based gateways and LoRaWANTM protocols.
